3867

Malaysian Pacific Industries

3867.KLSE mpind.my
Price N/A
MYR · KLSE
52-week range
27.05
50.80
Market Cap
8.09B
P/E Ratio
42.84
Forward P/E
32.05
Book Value
11.09
Div. Yield
0.98%
% Institutions
23.54%
% Insiders
57.11%

1 Year

+45.7%

3 Year

+49.6%

10 Year

+511.0%
Description

Malaysian Pacific Industries Berhad, an investment holding company, engages in the manufacturing, assembling, testing, marketing, and sale of integrated circuits, semiconductor devices, electronic components, and lead frames. The company also provides outsourced semiconductor packaging and testing services. It operates in Ireland, Taiwan, Malaysia, the United States, Singapore, the People's Republic of China, and internationally. The company was formerly known as Federal Paper Products Sdn Berhad and changed its name to Malaysian Pacific Industries Berhad in May 1983. The company was incorporated in 1962 and is based in Ipoh, Malaysia. Malaysian Pacific Industries Berhad is a subsidiary of Hong Leong Manufacturing Group Sdn Bhd.

Company Information

Company Name
Malaysian Pacific Industries
Sector
Technology
Industry
Semiconductors
Exchange
KLSE
ISIN: MYL3867OO008
Currency: MYR
Full Time Employees: 6,508
Phone: 60 3 2080 9200
Website: mpind.my
Fiscal Year End: June
Description:

Malaysian Pacific Industries Berhad, an investment holding company, engages in the manufacturing, assembling, testing, marketing, and sale of integrated circuits, semiconductor devices, electronic components, and lead frames. The company also provides outsourced semiconductor packaging and testing services. It operates in Ireland, Taiwan, Malaysia, the United States, Singapore, the People's Republic of China, and internationally. The company was formerly known as Federal Paper Products Sdn Berhad and changed its name to Malaysian Pacific Industries Berhad in May 1983. The company was incorporated in 1962 and is based in Ipoh, Malaysia. Malaysian Pacific Industries Berhad is a subsidiary of Hong Leong Manufacturing Group Sdn Bhd.

Address:

Jalan Lapangan Terbang, Ipoh, Malaysia, 31350

People

Directors & Officers

Name Title Year Born
Mr. Manuel Zarauza Brandulas Group MD & Executive Director 1971
Mr. Ping Ong Lau Chief Financial Officer 1976
Mr. Choe Khean Lee Head of China Operations for Carsem Semiconductor & Carsem Advanced 1967
Ms. Wei Fong Wong Group Company Secretary NA

Financial Highlights

Market Cap: $8.09B
EBITDA: $554.25M
P/E Ratio: $42.84
PEG Ratio: $0.96
Book Value: $11.09
Dividend/Share: $0.40
Dividend Yield: 0.98%
Earnings/Share: $0.95
Profit Margin: 7.10%
Operating Margin: 7.91%
ROA (TTM): 4.68%
ROE (TTM): 9.76%
Revenue (TTM): $2.65B
Revenue/Share (TTM): $13.32
Earnings Growth (YOY): 1.40%
Revenue Growth (YOY): 31.00%

Valuation Metrics

Enterprise Value: $7.63B
Trailing P/E: 42.84
Forward P/E: 32.05

Shares Statistics

Shares Outstanding: 198.84M
Shares Float: 81.59M
% Insiders: 57.11%
% Institutions: 23.54%

Stock Price History

1 Year Price History

3 Years Price History

10 Years Price History

Financial Charts

Revenue, Net Income & Operating Cash Flow (Yearly)

Revenue, Net Income & Operating Cash Flow (Quarterly)

Operating Expenses (Yearly)

Operating Expenses (Quarterly)

Balance Sheet (Quarterly)

Assets Breakdown (Yearly)

Assets Breakdown (Quarterly)

Liabilities Breakdown (Yearly)

Liabilities Breakdown (Quarterly)

Income Statement Waterfall

Open full waterfall
Line Item
Step Type
Value
Revenue
adjust
$2.65B
Cost of Goods Sold
adjust
$-2.33B
Gross Profit
subtotal
$322.30M
Other Operating Expense
adjust
$-77.04M
Operating Income
subtotal
$245.26M
Other / Non-Operating Items
adjust
$-57.22M
Net Income
subtotal
$188.04M

Earnings Per Share (EPS) History

Financial Ratios

📦 Raw API Data (JSON Explorer)

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